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“We partner closely with Pactech for every new design right from the beginning of the development process. With their involvement and expertise, we save time on sorting through component type and availability so the design, drawing, and prototype are correct the first time.”
https://www.pactech.com/customer-support/
Pac Tech – Packaging Technologies GmbH Am Schlangenhorst 7 – 9 14641 Nauen – Germany +49 (0) 3321 4495 – 100 [email protected]
PacTech is a worldwide leader in Wafer Level Bumping & Packaging Services. These services meet the high quality demands of our customers and support both engineering and prototyping services as well as high volume production. Read More
https://www.pactech.com/about-us-company-profile/
PacTech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment. As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech. also provides state-of-the-art worldwide contract services for low-cost wafer level bumping and packaging at competitive prices and highest quality.
https://pactech-inc.com/resources/
Welcome to Pactech Resource Center.. Here you can find a wide array of resources to help you to choose the perfect cable for your project. Articles. A Cable’s …
https://www.pactech.com/contact-us/
Contact Us Global Customer Service Contacts Global Sales Representatives China Shanghai NAGASE Trading Co., Ltd. 7F, The ECO CITY, No.1788 West Nanjin Road JinAn District Shanghai, China 200040 Mobile: +86 189 171 256 13 E-Mail: [email protected] URL: www.nagase.cn China D-Tek Technology Co., Ltd. Room 1003, No.71, Lane 1980 Luoxiu Road, Minghang District Shanghai, China …
https://pactech-inc.com/contact/
https://pac-audio.com/contact/
727-592-5991 Mon-Fri 9AM-8PM EST Sat 9AM-7PM EST
https://pacgdx.com/support/technical-support
On-Site Support Services. Designed with the installer in mind, PAC GDX provide on-site services and system upgrades. The Technical Support team are trained to the highest standard on PAC and GDX hardware, software, PC operating systems and IT networks.
https://www.pactech.com/about-us/
Pac Tech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment. As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech also provides state-of-the-art worldwide contract services for low-cost wafer level bumping and packaging at competitive prices and highest quality. …
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