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https://multimedia.3m.com/mws/media/634385O/3mtm-wafer-support-system-brochure.pdf
The 3M ™ Wafer Support System combines proprietary 3M temporary bonding technologies with world class equipment designed specifically to process wafers using 3M’s wafer support system materials – creating a complete, cost-effective solution for high-volume manufacturing of ultra-thin wafers for 3D TSV and related applications.
https://acronyms.thefreedictionary.com/Wafer+Support+System
WSS - Wafer Support System. Looking for abbreviations of WSS? It is Wafer Support System. Wafer Support System listed as WSS. ... In the laboratory's clean room the company has recently installed wafer support system to offer temporary wafer bonding service to IC packagers developing 3-dimension packaging technology.
https://patents.google.com/patent/US7186298B2/en
A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow ...Cited by: 578
https://www.izm.fraunhofer.de/content/dam/izm/de/documents/Abteilungen/ASSID_All_Silicon_System_Integration_Dresden/information%20sheet_Thin%20Wafer%20Handling%202011-11.pdf
wafer support system can be chosen. Even the cascaded use of the same support system or the combination of different style temporary wafer handling sys-tems is possible to enable thin wafer transfer bonding. IZM uses temporary wafer support systems for the fol-lowing applications: Extreme thinning and
https://www.bbftechnologies.com/products/fab-automation/wafer-demounter/
Wafer Demounter. After the wafer has been polished, it has to be removed from the polishing plate. We can help make this cumbersome task a bit more manageable. Whether you are using a template or a wax mounted wafer, we can build you a machine that utilizes a focused high-pressure stream of water to remove the wafer from the plate.
https://news.3m.com/press-release/company/3m-introduces-new-system-ultrathin-wafer-backgrinding
SAN FRANCISCO--(BUSINESS WIRE)--3M introduces the 3M Wafer Support System for ultrathin semiconductor wafer backgrinding. The new system is an alternative to the conventional tape process for backgrinding and is capable of producing wafers as thin as 20 microns. This new approach allows semiconductor manufacturers to use their existing grinding equipment to produce thinner wafers, at …
https://www.syagrussystems.com/
Syagrus Systems is a leader in post-fab for semiconductor and electronic components by providing silicon wafer backgrinding, wafer dicing, die inspection and sorting, and SMD Tape and Reel.
https://patents.google.com/patent/US6053982A/en
A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support wafers in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages ...Cited by: 578
https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=1560
A new support system is described for wafer thinning applications in which a final die thickness of less than 100 microns is desired. Thinning to 20 microns has been demonstrated, and bumped wafers can be routinely thinned to a final thickness of less than 50 microns. The integrated system consists of mounting and demounting hardware along with associated consumables and is designed to allow ...
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