Find all needed information about 3mtm Wafer Support System. Below you can see links where you can find everything you want to know about 3mtm Wafer Support System.
http://multimedia.3m.com/mws/media/634385O/3mtm-wafer-support-system-brochure.pdf
The 3M ™ Wafer Support System combines proprietary 3M temporary bonding technologies with world class equipment designed specifically to process wafers using 3M’s wafer support system materials – creating a complete, cost-effective solution for high-volume manufacturing of ultra-thin wafers for 3D TSV and related applications.
https://www.researchgate.net/publication/315510251_Study_of_a_siliconglass_bonded_structure_with_a_UV-curable_adhesive_for_temporary_bonding_applications
This paper concerns the study of a temporary bonding process: 3MTM Wafer Support System. This process is dedicated to the handling of thin silicon wafers with a glass carrier bonded with a UV ...
http://news.3m.com/press-release/company/3m-and-tazmo-announce-agreement-temporary-wafer-bonding-technology-enable-3-d-
The 3M Wafer Support System includes equipment and materials that allow for temporary wafer bonding to support wafer thinning and subsequent processing of ultra thin wafers for 3D packaging. 3M’s innovative use of a UV curable adhesive for wafer bonding to glass carriers provides robust wafer support throughout wafer grinding and throughout ...
https://dl.acm.org/citation.cfm?id=3097170
This paper concerns the study of a temporary bonding process: 3MTM Wafer Support System. This process is dedicated to the handling of thin silicon wafers with a glass carrier bonded with a UV curable polymer. The dismounting process is achieved after a laser treatment.Cited by: 2
http://multimedia.3m.com/mws/media/634384O/3m-tazmo-agree-on-temp-wafer-bonding-technology-dec-2009.doc?fn=Tazmo%20PR%20Final%20-%20113009.doc
As part of this agreement, TAZMO becomes a 3M Authorized Equipment Supplier for equipment that is configured to use 3MTM Wafer Support System (WSS) materials including 3M’s Liquid UV-Curable Adhesive and Light-To-Heat Conversion coating.
https://www.vlsiresearch.com/thin-wafer-handling-progress-PFEL1SE1B7CEOAV
Description: Challenges of 3D IC Manufacturing, Scope of Thin Wafer Handling, CMOS Imager Sensors, 3DIC Process Flow, Thin Wafer Handling Technology, Thin Wafer Handling TMAT, Thin Wafer Handling Thermo Slides, Material Brewer science, Thin Wafer Handling 3MTM WSS, Issues for Thin Wafer Handling, Carrierless W2W Bonding, TTV results after bonding, Thinning Testing, PECVD testing …
https://www.sciencedirect.com/science/article/pii/S0143749619300739
The Furukawa tape SP-537T-230 is used on a 450 mm DISCO frame (thinned or device wafer stuck onto the tape). The system {frame + tape + bond pair} is brought to the dismounting station which includes a specific clamping ring used to securely hold the carrier wafer and to enable its separation from the device.Author: K. Abadie, P. Montméat, T. Enot, F. Fournel, M. Wimplinger
https://link.springer.com/chapter/10.1007%2F978-3-319-45098-8_6
Nov 19, 2016 · A review on the available process technologies including temporary bonding, de-bonding, wafer thinning, thin wafer handling, thin wafer backside processes, and die singulation are discussed and summarized in this chapter. The fabricated thin dies are integrated and assembled using wafer level system integration (WLSI) processes.Cited by: 1
http://www.wiley.com/WileyCDA/WileyTitle/productCd-3527334661,subjectCd-PH62.html
Handbook of 3D Integration, Volume 3: 3D Process Technology. Philip Garrou ... 13 The 3MTM Wafer Support System (WSS) 175 Blake Dronen and Richard Webb. 13.1 Introduction 175. ... 15.3.2 Thermoplastic Glue Thin Wafer Support System – Thermal Slide Debondable System 196.
https://www.3m.com/3M/en_US/company-us/all-3m-products/~/3M-Ultra-Thin-Water-Contact-Indicator-Tape-5558/?N=5002385+3294001740&rt=rud
3M™ Water Contact Indicator Tape 5558 is an ultra-thin, 6.0 mil (152 micron) thick tape used to indicate water contact. The tape turns from white to red upon direct water contact.
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