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https://espace.cern.ch/asics-support
The CERN EP-ESE group is offering a set of services to collaborating institutes for the exploitation of state of the art microelectronic technologies for the implementation of front-end electronic circuits in the High Energy Physics experiments. ASIC Technology Support
https://asicsupport-community.web.cern.ch/
ASIC Support ... ASIC Support
https://lhcathome.cern.ch/lhcathome/forum_thread.php?id=4480
Sep 27, 2008 · Maybe ask at the main boinc froum if there is any project that support ASIC, however I doubt it as the point of an ASIC is the hardware is dedicated for an application not general purpose like GPU. ID: 37749 · Reply Quote: ... Windows: Using GPU and ASIC miner ©2020 CERN ...
https://indico.cern.ch/event/799025/attachments/package
The workshop will cover all aspects of electronics for particle physics experiments, and accelerator instrumentation of general interest to users. LHC experiments (and their operational experience) will remain a focus of the meeting but a strong emphasis on R&D for future experimentation will be maintained, such as SLHC, CLIC, ILC, neutrino facilities as well as other particle and ...
http://project-dcdc.web.cern.ch/project-dcdc/
Development of DCDC converters @ CERN. A short history. The R&D effort to develop DCDC converters for applications in High Energy Physics, with specific emphasis on the upgrade of LHC detectors, started at CERN around 2007.
https://kt.cern/technologies/nino
CERN has available a low power front-end amplifier discriminator ASIC chip for use in applications based on electron and photon detecting in medical imaging, life science or material research. This so-called NINO ASIC allows for an 8-channel input signal charge measurement through encoding discriminator pulse width with excellent timing resolution at very high rate, while at the same time ...
https://bondlab-qa.web.cern.ch/bondlab-qa/BondingIssues_Honma_Oct2015.pdf
The CERN wire bonding lab In one year we typically process 40-50 one-offs, 40-50 small series, and 1 or 2 large scale production jobs. Thus we get a huge variety of bonding surfaces, bonding configurations, mechanical (support) configurations, and levels of bonding complexity.
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